Back
TBIG - Tower Bersama Infrastructure

TBIG - Raises IDR1.5 tn in bond issuance

13 July 2023

Tower Bersama Infrastructure (TBIG) has concluded its phase I bond issuance totaling IDR1.5tn, comprising of two series that yield 5.9% for A series amounting IDR1 tn and 6.25% for B series amounting IDR500 bn. This was part of shelf-registered bonds VI 2023 targeting IDR20 tn in funds. The bond issuance is intended to refinance its debt. (Source : Kontan)

Related Research

Telecommunication & Tower
TBIG - Jump on fiber bandwagon
Devi Harjoto 05 December 2023 See Detail
Telecommunication & Tower
TBIG - Outlook to stay modest
Devi Harjoto 12 December 2022 See Detail
Telecommunication & Tower
TBIG - Hampered by strong dollar and monetary tightening
Devi Harjoto, Alfiansyah 19 July 2022 See Detail